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Tower CPU Cooler with 4 Copper Heatpipes on Motherboard Cutaway (9 Bodies)
9-body electronics thermal management assembly on an FR-4 motherboard with quarter cutaway through the 20-fin aluminum radiator stack, anodized top plate, and 120 mm axial cooling fan frame.
High-TDP processors rely on copper heatpipes embedded in a CNC copper coldplate to transport heat into a dense stack of stamped aluminum fins cooled by a 120 mm axial fan. Every fin plate and the copper base feature precision boolean bores and semi-cylindrical channels so the 4 U-shaped heatpipes pass cleanly through the stack with zero solid overlap.
1. Geometry & FEA Mesh
- •9 independent solid bodies: FR-4 motherboard PCB, CPU socket & IHS, steel backplate with standoffs, copper coldplate, 4 copper U-heatpipes, 20-fin aluminum radiator stack (cutaway), anodized top cover (cutaway), 120 mm fan frame (cutaway), and 9-blade axial impeller.
- •Zero CAD Collisions Gate verified: 0.000 mm³ overlap across all 9 bodies.
2. Loads & Boundary Conditions
- •Clearance holes in PCB for backplate standoffs and in all 20 aluminum fins for the 8 vertical heatpipe legs.
3. Simulation Results & Findings
- ✓Interactive 9-body electronics cooling assembly ready for thermal conduction, structural mounting preload, or airflow inspection.
Showcases precision multi-body electronics packaging and heatsink CAD modeling in WebCAE.
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